HiCONNECTS at EuroPAT Workshop
We were thrilled to see HiCONNECTS featured at the 3rd [...]
We were thrilled to see HiCONNECTS featured at the 3rd [...]
We are thrilled to announce that HiCONNECTS featured at SEMICON [...]
We are delighted to invite you to the first ever [...]
HiCONNECTS was featured at SEMI Europe's 3D & Systems Summit 2024 [...]
We are delighted that Dimitrios Velenis from imec will speak [...]
We would like to inform our followers that three consortium [...]
We were delighted to see that many of our consortium [...]
HiCONNECTS Consortium members met at the White Atrium building, home [...]
The HiCONNECTS 12-Month Consortium Meeting took place in Catania last [...]
Three partners were officially inducted into the HiCONNECTS project at [...]
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HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.