HiCONNECTS at SEMICON Europa 2024: Pioneering Innovation and Collaboration in Semiconductor Standardization
SEMICON Europa 2024 was a hub of groundbreaking discussions and [...]
SEMICON Europa 2024 was a hub of groundbreaking discussions and [...]
HiCONNECTS made a remarkable impact at EFECS 2024, held in [...]
We’re thrilled to announce that six of our HiCONNECTS consortium [...]
HiCONNECTS is excited to announce that we will be attending [...]
We were thrilled to see HiCONNECTS featured at the 3rd [...]
We are thrilled to announce that HiCONNECTS featured at SEMICON [...]
We are delighted to invite you to the first ever [...]
HiCONNECTS was featured at SEMI Europe's 3D & Systems Summit 2024 [...]
We are delighted that Dimitrios Velenis from imec will speak [...]
We would like to inform our followers that three consortium [...]
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HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.