We are delighted that Dimitrios Velenis from imec will speak on behalf of HiCONNECTS at SEMI Europe‘s 3D & Systems Summit, taking place in Dresden, Germany next week!
Dimitrios will speak about the topic of Heterogeneous Integration of Photonic Interconnects to Address AI Challenges. This presentation will feature in the session on Semiconductor Market Trends and European Impact where the aim is to analyze the dynamic relationship between global semiconductor trends and the European landscape.
We would be delighted to see you support HiCONNECTS at the 3D & Systems Summit whose focus is on explaining a dynamic framework where components seamlessly collaborate to power the next generation of technological innovations.
You can register here.
