HiCONNECTS was featured at SEMI Europe‘s 3D & Systems Summit 2024 in Dresden. Dimitrios Velenis from imec spoke about the topic of Heterogeneous Integration of Photonic Interconnects to Address AI Challenges.
His presentation was part of a session on Semiconductor Market Trends and European Impact where the aim was to analyze the dynamic relationship between global semiconductor trends and the European landscape.
In front of a huge audience comprising the most prominent names in the industry alongside new and innovative companies, HiCONNECTS branding featured prominently at the conference venue and attendees have picked up the brochure which summarized the key objectives of our project.
Taking place between 12 and 14 June, the 3D & Systems Summit 2024 focused on explaining a dynamic framework where components seamlessly collaborate to power the next generation of technological innovations.
