HiCONNECTS Joins SEMICON Taiwan 2025 to Explore the Future of Heterogeneous Integration
We’re proud to announce that Kartikey Srivastava, Senior Specialist, Communications [...]
We’re proud to announce that Kartikey Srivastava, Senior Specialist, Communications [...]
We had the pleasure of seeing HiCONNECTS take center stage [...]
This week, we were proud to represent HiCONNECTS at Silicon [...]
This week, we were thrilled to see Vincent Martinez from [...]
This week, we gathered at the Chips Joint Undertaking office [...]
Last week, the APC|M Conference in Prague brought together experts [...]
Earlier this week, the HiCONNECTS consortium gathered at imec in [...]
SEMICON Europa 2024 was a hub of groundbreaking discussions and [...]
HiCONNECTS made a remarkable impact at EFECS 2024, held in [...]
We’re thrilled to announce that six of our HiCONNECTS consortium [...]
© 2023 HiCONNECTS. All Rights Reserved
HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.