Welcome to the Chips JU project
The HiCONNECTS project develops the next generation of electronic components and systems heterogeneous integration core technology solutions for energy-efficient, high-performance wireless/wired cloud and edge computing and automotive radar in support of the next radio frequency and IT technology evolution.
The Mission
The HiCONNECTS project will enable both wired/wireless networks and edge/cloud data centers of the future to operate with high performance and reliability, increasing overall energy efficiency. Likewise, the project will enable enhanced sensing capabilities for radars by supporting parallel technology and packaging integration, allowing increased link budget and bandwidth while reducing the Bill of Material cost for the overall system.
Start: 1 January 2023 | Duration: 36 months
HiCONNECTS at INSIDE Connect25 in Málaga
We had the pleasure of seeing HiCONNECTS featured at INSIDE Connect25 in Málaga. In a presentation titled Situational Awareness Center [...]
HiCONNECTS at SEMICON Taiwan
We had the pleasure of seeing HiCONNECTS showcased at SEMICON Taiwan during the Heterogeneous Integration Global Summit. In a session [...]
WEBINAR: Heterogeneous Integration in Action: Powering the Next Era of Connectivity
HiCONNECTS - Heterogeneous Integration for Connectivity and Sustainability - is a flagship Chips JU project driving this mission forward. With [...]
WEBINAR: Heterogeneous Integration in Action: Powering the Next Era of Connectivity
HiCONNECTS - Heterogeneous Integration for Connectivity and Sustainability - is a flagship Chips JU project driving this mission forward. With [...]
HiCONNECTS Presentations at SEMICON Europa
We’re thrilled to announce that six of our HiCONNECTS consortium members will be taking the stage at this year’s SEMICON [...]
HiCONNECTS at EFECS 2024
HiCONNECTS is excited to announce that we will be attending EFECS 2024, taking place on 5-6 December in Ghent, Belgium! [...]
The Consortium
