Welcome to the Chips JU project
The HiCONNECTS project develops the next generation of electronic components and systems heterogeneous integration core technology solutions for energy-efficient, high-performance wireless/wired cloud and edge computing and automotive radar in support of the next radio frequency and IT technology evolution.
The Mission
The HiCONNECTS project will enable both wired/wireless networks and edge/cloud data centers of the future to operate with high performance and reliability, increasing overall energy efficiency. Likewise, the project will enable enhanced sensing capabilities for radars by supporting parallel technology and packaging integration, allowing increased link budget and bandwidth while reducing the Bill of Material cost for the overall system.
Start: 1 January 2023 | Duration: 36 months
HiCONNECTS at SEMICON Europa 2024: Pioneering Innovation and Collaboration in Semiconductor Standardization
SEMICON Europa 2024 was a hub of groundbreaking discussions and technological advancements, and HiCONNECTS was proud to be at the [...]
HiCONNECTS at EFECS 2024 in Ghent
HiCONNECTS made a remarkable impact at EFECS 2024, held in the vibrant city of Ghent, Belgium. Over the course of [...]
HiCONNECTS at EuroPAT Workshop
We were thrilled to see HiCONNECTS featured at the 3rd EuroPAT Workshop on September 10th, 2024 The workshop offered valuable [...]
HiCONNECTS Presentations at SEMICON Europa
We’re thrilled to announce that six of our HiCONNECTS consortium members will be taking the stage at this year’s SEMICON [...]
HiCONNECTS at EFECS 2024
HiCONNECTS is excited to announce that we will be attending EFECS 2024, taking place on 5-6 December in Ghent, Belgium! [...]
Register now for HiCONNECTS Webinar
We are delighted to invite you to the first ever HiCONNECTS specific webinar to be held on September 10th. With [...]
The Consortium
