HiCONNECTS presentation at 3D & Systems Summit
HiCONNECTS was featured at SEMI Europe's 3D & Systems Summit 2024 [...]
HiCONNECTS was featured at SEMI Europe's 3D & Systems Summit 2024 [...]
We were delighted to see that many of our consortium [...]
HiCONNECTS Consortium members met at the White Atrium building, home [...]
The HiCONNECTS 12-Month Consortium Meeting took place in Catania last [...]
Three partners were officially inducted into the HiCONNECTS project at [...]
Our partners are working together on pioneering solutions to develop [...]
We are delighted to inform our followers that HiCONNECTS consortium [...]
The HiCONNECTS project and Horsa, a consortium member, were featured [...]
HiCONNECTS was introduced to the attendees at the recently [...]
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HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.