HiCONNECTS was introduced to the attendees at the recently concluded 3D & Systems Summit, organized by consortium member SEMI Europe, and held in Dresden, Germany.
Laith Altimime, President of SEMI Europe, spoke about the project during the Welcome Remarks and attendees were encouraged to visit the website to learn more about HiCONNECTS.
The SEMI 3D & Systems Summit was dedicated to Smarter Systems through Heterogeneous Integration. Industry experts shared their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.
To learn more about this Summit, please visit this link:
