HiCONNECTS Presentations at SEMICON Europa
We’re thrilled to announce that six of our HiCONNECTS consortium [...]
We’re thrilled to announce that six of our HiCONNECTS consortium [...]
HiCONNECTS is excited to announce that we will be attending [...]
We were thrilled to see HiCONNECTS featured at the 3rd [...]
HiCONNECTS was featured at SEMI Europe's 3D & Systems Summit 2024 [...]
We are delighted that Dimitrios Velenis from imec will speak [...]
We were delighted to see that many of our consortium [...]
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HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.