SEMICON Europa 2024 was a hub of groundbreaking discussions and technological advancements, and HiCONNECTS was proud to be at the forefront of this global event. The platform provided a remarkable opportunity to showcase our innovative contributions and collaborate with industry leaders driving the future of semiconductor technology. 

HiCONNECTS at the TechArena 

One of the highlights of SEMICON Europa was the HiCONNECTS session at the TechArena, where seven distinguished speakers shared insights on transformative technologies shaping the semiconductor industry. 

  • Lawrence Luo from Imec presented advancements in High-Speed Silicon Photonics I/O for Co-Packaged Pilot Lines, highlighting its potential to revolutionize interconnect performance. 
  • Erich Schlaffer from AT&S AG discussed Novel Interconnect Solutions designed to improve signal integrity, a critical requirement for next-generation systems. 
  • Julius Hållstedt from Excillum focused on the advantages of Sharper Scans and Faster Ramp-Up in semiconductor processes. 
  • Ralf Schmid from ICT GmbH – Applied Materials provided insights into Advanced Packaging Industry Trends and cutting-edge eBeam-based solutions. 
  • Kartikey Srivastava from SEMI Europe concluded with an overview of how projects like HiCONNECTS are influencing the European semiconductor ecosystem and driving Europe’s leadership in technology. 

 

HiCONNECTS Standards Meeting: Driving Progress 

Following the TechArena presentations, the hybrid HiCONNECTS Standards Meeting continued the momentum with a deep dive into standardization advancements. 

Led by Daniele Pagano, Project Manager at STMicroelectronics and Task Leader for HiCONNECTS standardization, the session provided a comprehensive update on the project’s progress. Key contributions came from: 

  • Laura Nguyen from SEMI US, who outlined SEMI Standards and their role in fostering collaboration and innovation. 
  • Dani Alon from CoreTigo, who explored advancements in IO-Link wireless standards. 
  • Andres Torres from Siemens EDA, who discussed how standards enable data-driven digital twins. 
  • Vincent Martinez from NXP, who shared updates on automotive radar standardization. 
  • Dr. Bilal Hachemi from the Yole Group, who highlighted recent developments in heterogeneous integration, systems packaging, and glass technologies. 

Special recognition goes to Laura Nguyen and Dr. Hilal for their invaluable external expert perspectives, which have enriched HiCONNECTS’ strategic direction and vision. 

 

A Collaborative Future with Chips JU 

HiCONNECTS extends its deepest gratitude to Chips JU for their sponsorship and support. Their commitment to advancing semiconductor innovation in the EU has been instrumental in driving the success of initiatives like HiCONNECTS. 

Celebrating Success and Looking Ahead 

SEMICON Europa 2024 was a powerful reminder of what collaboration and innovation can achieve. From engaging sessions to inspiring discussions at the EU Projects booth, the event underscored the collective effort to shape a more connected, innovative future in semiconductors. 

HiCONNECTS remains committed to driving meaningful change in the semiconductor industry through continued collaboration and technological advancements. Stay tuned as we build on the momentum of SEMICON Europa and pave the way for future breakthroughs.