HiCONNECTS at APC|M Conference: Innovation and Collaboration
Last week, the APC|M Conference in Prague brought together experts [...]
Last week, the APC|M Conference in Prague brought together experts [...]
HiCONNECTS was featured at SEMI Europe's 3D & Systems Summit 2024 [...]
We are delighted that Dimitrios Velenis from imec will speak [...]
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HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.