HiCONNECTS at SEMICON Europa 2024: Pioneering Innovation and Collaboration in Semiconductor Standardization
SEMICON Europa 2024 was a hub of groundbreaking discussions and [...]
SEMICON Europa 2024 was a hub of groundbreaking discussions and [...]
HiCONNECTS made a remarkable impact at EFECS 2024, held in [...]
HiCONNECTS is excited to announce that we will be attending [...]
We are delighted to invite you to the first ever [...]
We are delighted that Dimitrios Velenis from imec will speak [...]
We would like to inform our followers that three consortium [...]
We were delighted to see the presence of HiCONNECTS at [...]
The HiCONNECTS project will feature at SEMICON Europa with presentations [...]
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HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.