We were delighted to see the presence of HiCONNECTS at SEMICON Europa. Four of our esteemed consortium members spoke at the ‘EU Digital Future Forum’ session at the TechARENA.
Andrea Sanfilippo from NXP Semiconductors introduced the project, Dimitrios Velenis from imec spoke on the Photonics Heterogeneous Integration Pilot Line, Ayad Ghannam, PhD from 3DiS Technologies on 3D-RDL & TPV-based Advanced Wafer-Level packaging Pilot Line for RF applications and Daniele Pagano from STMicroelectronics Italia on Enhanced Chip Manufacturing Developments. They presented with great passion and the content was received positively by the attendees.
Over the coming years, more events such as these will include speakers from the consortium as they present achievements from the project so stay tuned!
