HiCONNECTS at EFECS 2025 -Driving Europe’s ECS Future
HiCONNECT is proud to announce its participation in EFECS 2025, [...]
HiCONNECT is proud to announce its participation in EFECS 2025, [...]
HiCONNECTS is proud to feature prominently at SEMICON Europa 2025 [...]
The final HiCONNECTS Standards Workshop will take place on 20 [...]
This week, we gathered at the Chips Joint Undertaking office [...]
Last week, the APC|M Conference in Prague brought together experts [...]
Earlier this week, the HiCONNECTS consortium gathered at imec in [...]
We’re thrilled to announce that six of our HiCONNECTS consortium [...]
HiCONNECTS is excited to announce that we will be attending [...]
We are delighted to invite you to the first ever [...]
We are delighted that Dimitrios Velenis from imec will speak [...]
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HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.