HiCONNECTS at EFECS 2025 -Driving Europe’s ECS Future
HiCONNECT is proud to announce its participation in EFECS 2025, [...]
HiCONNECT is proud to announce its participation in EFECS 2025, [...]
The final HiCONNECTS Standards Workshop took place on 20 November [...]
HiCONNECTS was pleased to take part in SEMICON Europa 2025, [...]
HiCONNECTS is proud to feature prominently at SEMICON Europa 2025 [...]
The final HiCONNECTS Standards Workshop will take place on 20 [...]
The HiCONNECTS webinar “Heterogeneous Integration in Action: Powering the Next [...]
We had the pleasure of seeing HiCONNECTS featured at INSIDE [...]
We had the pleasure of seeing HiCONNECTS showcased at SEMICON [...]
HiCONNECTS - Heterogeneous Integration for Connectivity and Sustainability - is [...]
We’re proud to announce that Kartikey Srivastava, Senior Specialist, Communications [...]
© 2023 HiCONNECTS. All Rights Reserved
HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.