HiCONNECTS at EFECS 2025 -Driving Europe’s ECS Future
HiCONNECT is proud to announce its participation in EFECS 2025, [...]
HiCONNECT is proud to announce its participation in EFECS 2025, [...]
The final HiCONNECTS Standards Workshop took place on 20 November [...]
HiCONNECTS was pleased to take part in SEMICON Europa 2025, [...]
HiCONNECTS is proud to feature prominently at SEMICON Europa 2025 [...]
The final HiCONNECTS Standards Workshop will take place on 20 [...]
We were delighted to see the presence of HiCONNECTS at [...]
The HiCONNECTS project will feature at SEMICON Europa with presentations [...]
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HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.