HiCONNECTS at EFECS 2025 -Driving Europe’s ECS Future
HiCONNECT is proud to announce its participation in EFECS 2025, [...]
HiCONNECT is proud to announce its participation in EFECS 2025, [...]
HiCONNECTS was pleased to take part in SEMICON Europa 2025, [...]
HiCONNECTS is proud to feature prominently at SEMICON Europa 2025 [...]
We’re thrilled to announce that six of our HiCONNECTS consortium [...]
We were delighted to see that many of our consortium [...]
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HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.