HiCONNECTS at SEMICON Europa 2024: Pioneering Innovation and Collaboration in Semiconductor Standardization
SEMICON Europa 2024 was a hub of groundbreaking discussions and [...]
SEMICON Europa 2024 was a hub of groundbreaking discussions and [...]
HiCONNECTS made a remarkable impact at EFECS 2024, held in [...]
We were thrilled to see HiCONNECTS featured at the 3rd [...]
We are thrilled to announce that HiCONNECTS featured at SEMICON [...]
HiCONNECTS was featured at SEMI Europe's 3D & Systems Summit 2024 [...]
We were delighted to see that many of our consortium [...]
HiCONNECTS Consortium members met at the White Atrium building, home [...]
The HiCONNECTS 12-Month Consortium Meeting took place in Catania last [...]
Three partners were officially inducted into the HiCONNECTS project at [...]
Our partners are working together on pioneering solutions to develop [...]
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HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.