HiCONNECTS Second Review Meeting
This week, we gathered at the Chips Joint Undertaking office [...]
This week, we gathered at the Chips Joint Undertaking office [...]
Last week, the APC|M Conference in Prague brought together experts [...]
Earlier this week, the HiCONNECTS consortium gathered at imec in [...]
SEMICON Europa 2024 was a hub of groundbreaking discussions and [...]
HiCONNECTS made a remarkable impact at EFECS 2024, held in [...]
We were thrilled to see HiCONNECTS featured at the 3rd [...]
We are thrilled to announce that HiCONNECTS featured at SEMICON [...]
HiCONNECTS was featured at SEMI Europe's 3D & Systems Summit 2024 [...]
We were delighted to see that many of our consortium [...]
HiCONNECTS Consortium members met at the White Atrium building, home [...]
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HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.