HiCONNECTS at SEMI Europe’s 3D & Systems Summit 2025
We had the pleasure of seeing HiCONNECTS take center stage [...]
We had the pleasure of seeing HiCONNECTS take center stage [...]
This week, we were proud to represent HiCONNECTS at Silicon [...]
This week, we were thrilled to see Vincent Martinez from [...]
This week, we gathered at the Chips Joint Undertaking office [...]
Last week, the APC|M Conference in Prague brought together experts [...]
Earlier this week, the HiCONNECTS consortium gathered at imec in [...]
HiCONNECTS is excited to announce that we will be attending [...]
We were thrilled to see HiCONNECTS featured at the 3rd [...]
We are delighted to invite you to the first ever [...]
The HiCONNECTS 12-Month Consortium Meeting took place in Catania last [...]
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HiCONNECTS has received funding from Chips Joint Undertaking (Chips JU) under grant agreement No 101097296. Chips JU receives support from the European Union’s Horizon Europe research and innovation programme and Austria, Italy, Germany, Netherlands, Israel, Finland, Switzerland, Hungary, Sweden, Turkey, France, Denmark and Romania.