The HiCONNECTS webinar “Heterogeneous Integration in Action: Powering the Next Era of Connectivity” has now taken place, bringing together experts from across industry and research to explore how heterogeneous integration is shaping the future of high-speed, sustainable connectivity in Europe and beyond.
The full webinar recording is now available to watch on demand.

Advancing Europe’s Connectivity Ecosystem

HiCONNECTS is a flagship Chips Joint Undertaking (Chips JU) project, uniting more than 60 partners from across Europe’s research, design, and manufacturing ecosystem. The project is focused on developing advanced heterogeneous integration platforms that enable future-proof communication systems — spanning cloud, edge, RF, automotive, AI, and IoT applications.

As chips continue to underpin Europe’s digital economy, the webinar highlighted how innovation across the entire microelectronics value chain is essential to strengthening Europe’s technological leadership.

Highlights from the Webinar

The session opened with welcome remarks from Ilan Englard, EU Projects Manager and HiCONNECTS Coordinator on behalf of NXP, who set the scene for the project’s vision and objectives.

The technical programme featured contributions from across the consortium and beyond:

  • Daniele Pagano (STMicroelectronics) presented key perspectives from large-scale semiconductor manufacturing and collaborative innovation, drawing on extensive experience across EU-funded projects and industrial operations.

  • Hüseyin Yurdakul (Bluepath Robotics) shared insights into autonomous mobile robotics, highlighting how advanced integration technologies support intelligent automation in industrial environments.

  • Julio Ortiz (Thermo Fisher Scientific) explored the role of advanced imaging and cryo-electron microscopy techniques, underlining their importance in materials analysis and semiconductor research.

  • Tolga Bodrumlu (AVL) discussed applications in autonomous driving and AD/ADAS systems, showcasing how heterogeneous integration supports perception, sensor fusion, and safety-critical systems.

A lively Q&A session followed, enabling participants to engage directly with the speakers and explore cross-sector perspectives on connectivity, scalability, and sustainability.

Why Watch the Recording?

This webinar offers valuable insights for:

  • Semiconductor and electronics professionals

  • Researchers and technologists

  • System designers and manufacturing experts

  • Policymakers and ecosystem stakeholders

It provides a clear view of how heterogeneous integration is enabling next-generation connectivity — from cloud-to-edge computing and 5G/6G systems to autonomous mobility and energy-efficient architectures.

Watch the Webinar On Demand

If you missed the live session, or would like to revisit the discussions, the full webinar recording is now available to watch here: https://www.youtube.com/watch?v=m5-cR0YP8iU