HiCONNECTS – Heterogeneous Integration for Connectivity and Sustainability – is a flagship Chips JU project driving this mission forward. With over 60 partners from across Europe’s research, design, and manufacturing ecosystem, the project is developing advanced integration platforms for future-proof, high-speed communication systems.
Chips are the engines of our digital economy – embedded in everything from AI and cloud infrastructure to smart mobility and edge devices. Europe is working to strengthen its leadership in next-generation semiconductor technologies by fostering innovation across the entire microelectronics value chain.
From cloud-to-edge computing, to RF front-ends for 5G/6G, to energy-efficient architectures for IoT and AI – HiCONNECTS addresses the critical challenges of connectivity, sustainability, and scalability. The project’s work spans cutting-edge technologies in packaging, materials, and architecture, with a strong focus on accelerating industrial uptake.
This webinar will spotlight key technical achievements from across the consortium and explore how heterogeneous integration is unlocking new possibilities for Europe’s digital and industrial future.
