We’re proud to announce that Kartikey Srivastava, Senior Specialist, Communications at SEMI Europe, will represent the HiCONNECTS initiative at SEMI Taiwan 2025 as part of the Heterogeneous Integration Global Summit – Day 2.

This year’s theme, “Revolutionizing Heterogeneous Integration: Pioneering Trends, Breakthrough Applications, and Future Solutions,” reflects the rapid evolution of semiconductor technologies. The forum will bring together global industry leaders to share groundbreaking innovations and collaborative strategies shaping the future of the chip ecosystem.

Key Topics to Be Explored:

  • Chiplet Technology

  • Co-Packaged Optics & Optical Engines

  • Advanced Substrate and Testing Solutions

  • Cost-Effective Heterogeneous Integration

  • HPC, HBM, and Advanced Thermal Management

  • GaN Packaging for Automotive Applications

  • Connectivity Solutions for AI and High-Speed Data Systems

Kartikey will contribute to discussions centered on global collaboration and the strategic partnerships driving innovation in heterogeneous integration. His participation aligns with this year’s broader SEMICON Taiwan theme:

“Leading with Collaboration. Innovating with the World.”

This message of international cooperation is central to HiCONNECTS’ mission—developing a more connected, intelligent, and sustainable semiconductor future through collaborative research and cross-border partnerships.

Event Information:

  • Forum: Heterogeneous Integration Global Summit – Day 2

  • Date: September 11, 2025

  • Location: Taipei Nangang Exhibition Center, Halls 1 & 2

  • International Forum Dates: September 8–12, 2025

  • Exhibition Dates: September 10–12, 2025

📍 Learn more about SEMICON Taiwan 2025:
https://www.semicontaiwan.org/en

We invite all stakeholders in the semiconductor value chain to join us for this pivotal conversation on the next frontier in microelectronics.

Learn more about SEMICON Taiwan: https://lnkd.in/e4wVfuiM