We had the pleasure of seeing HiCONNECTS take center stage at SEMI Europe’s 3D & Systems Summit 2025 in the historic city of Dresden.
In a session titled European Readiness: Design, Materials, Manufacturing, Andrea Sanfilippo, Senior Manager at NXP Semiconductors, presented the HiCONNECTS project to an audience of industry leaders, innovators, and policymakers – spotlighting how our work is shaping the future of Europe’s semiconductor ecosystem.
Andrea’s presentation focused on how HiCONNECTS is advancing heterogeneous integration core technologies – driving innovation in chiplets, 3D integration, and scalable manufacturing. These technologies are critical to enabling energy-efficient, high-performance electronic systems that support everything from cloud and edge computing to automotive radar and the next wave of RF and IT evolution.
As the Summit explored strategies to boost Europe’s semiconductor resilience, HiCONNECTS stood out as a shining example of European collaboration, technical excellence, and forward-thinking design.
A huge thank you to SEMI Europe for the opportunity to showcase our progress – and to Andrea and the NXP team for representing HiCONNECTS with such clarity and vision. The energy, insight, and innovation on display at this year’s Summit inspire us to keep pushing boundaries.
Learn more about HiCONNECTS 👉 https://lnkd.in/etjj2EB8
Learn more about the 3D & Systems Summit 👉 https://lnkd.in/exHma_F
Here’s to the future of European semiconductor leadership.
